Introducing ALPHA® Argomax™ 2040 and 5040
As we announced in our ALPHA® Argomax™Newsletter #5 in January, we will continue to break new ground in semiconductor materials innovation in 2012. Our new ALPHA® Argomax™ 2040 and 5040 sinter technology products with our Advanced Dispense Technology (ADT) offer excellent die bonding, just like our successful Argomax™ 2000 and 5000 Series products, and these new products can be easily dispensed in standard die bonding equipment in high volume manufacturing processes..
Indeed, a primary feature of the ADT process is its ease of implementation: dispensing Argomax™ 2040 or 5040 in a standard die bonder; and then using a fixture to apply low pressure, allow you to achieve the same high reliability Argomax™ delivers with a common oven.
Our new Argomax™ products will deliver the same unsurpassed process capabilities as our other Argomax™ Sinter Technology products, including fast sintering for increased throughput and low pressure processing to protect valuable components.
Alpha’s standard for Reliability remains extremely high: Argomax™ 2040 and Argomax™ 5040 Dispense paste will enable again the highest levels of reliability in the market, creating bonds that can withstand 200°C operational temperatures and that can survive more than 1000 cycles under severe conditions such as -40°C/+175°C for high temperature silicon applications, and -50°C/+200°C for the demanding next generation applications using SiC and GaN.
Look for our April Argomax™ Newsletter in which we will announce a major breakthrough technology never before seen in the power market. We will open new horizons in High Volume Manufacturing for the Semiconductor world. For immediate response to any Argomax™ questions you may have, please send an email to: firstname.lastname@example.orgClick here to view the pdf