Indeed, a primary feature of the ADT process is its ease of implementation: dispensing Argomax™ 2040 or 5040 in a standard die bonder; and then using a fixture to apply low pressure, allow you to achieve the same high reliability Argomax™ delivers with a common oven.

Our new Argomax™ products will deliver the same unsurpassed process capabilities as our other Argomax™ Sinter Technology products, including fast sintering for increased throughput and low pressure processing to protect valuable components.

Alpha’s standard for Reliability remains extremely high: Argomax™ 2040 and Argomax™ 5040 Dispense paste will enable again the highest levels of reliability in the market, creating bonds that can withstand 200°C operational temperatures and that can survive more than 1000 cycles under severe conditions such as -40°C/+175°C for high temperature silicon applications, and -50°C/+200°C for the demanding next generation applications using SiC and GaN.