Argomax™ promises to revolutionize the attachment of Si to Cu, and demonstrate high levels of reliability never before achieved. In customer testing, Argomax™ passed >1000 cycles at severe temperature ranges (-50°C/200°C) in a product where the CTE mismatch was 15 ppm/°C.

Our complete line of Argomax™ products will provide unsurpassed process capabilities: sintering in seconds for increased throughput and low pressure to protect valuable components. This combination of process capabilities and product performance is ideal for high temperature Si, thin die, SiC and GaN.

As a result of our intensive R&D work and collaboration with major power semiconductor manufacturers throughout the world, Argomax™ sinter technology has been selected for use in their most demanding die attach applications. Let ALPHA® Argomax™ sinter technology revolutionize your die attach process.